Via - Redistribution Layer (RDL)

Confined I/O pad locations to the periphery of the IC and the integration of off-the shelf chips from multiple suppliers has been a problem for designers. MCSP's glass sheet redistribution layer solves the redistribution and mixed integration dilemma without the need for expensive packaging solutions. Designers have higher design flexibility, lower costs (including lower NRE) and a shorter time to market with lower risk. Thin-film trace deposition through MCSP processed glass via's allows designers the flexibility and advantages previously unobtainable in the marketplace. MCSP's full suite of standard & custom design tools including custom tools to be able to effectively model both over all package design parameters as well as individual component level performance can reduce costs and define design metrology criteria before production.