Both 3D stacking and Optoelectronic WLCSP, in particular, show significant commercial promise for the
development of advanced integrated circuits. The optically clear glass substrate and adhesive structure of the
MCSP technology can be applied to hybrid and monolithic OEIC packaging solutions with Vertical Cavity
Surface Emitting Laser (VCSEL), Optical Lensing and Photodetectors fabricated as components on the
The marriage of silicon, III-V materials and holographic lenses with WLCSP provides the capability for development of optical multiplexing/de-multiplexing filters and interconnects. Stacking vertically multiple independent IC technologies into one 3D package using MCSP technology further enhances the growing requirements of functionality, speed and PCB real estate demands the cellular and microelectronic industry require.