Passive & Active Devices

Many electronics applications have serious space considerations that are pressuring manufacturers to reduce component size. Much of the motivation for this has come from military and aerospace needs, but today's miniaturization demands are more likely to come from other market segments including telecommunications (cellular phones), computers (laptops), instrumentation (handheld devices), and medical electronics (pacemakers). Such applications continue to drive size reduction in components for commercial uses as well as for applications with very high reliability requirements.

Miniaturization has been a key contributor to advances in electronic technology. Certainly, miniaturization has been made possible mostly through remarkable breakthroughs in reducing the size of active components. But as integrated circuits (ICs) get smaller and more complex, there is an increasing need to also reduce the space required for the supporting passive components.

Simply reducing the case size of a part is not always the most effective way to miniaturize or increase performance. Ever increasing processing speeds, lower operating voltages, more stringent compliance criteria and the continual drive to reduce the overall cost of ownership have been significant drivers in the adoption of integrated passive components by design engineers. Chip-scale packaging alone can not completely satisfy these requirements. MCSP technologies passive component designs combine discrete components into volumetric-efficient multi-element packages. The MCSP integrated passive component designs combine multiple resistive and capacitative elements on a single chip, and these may be interconnected in a variety of network and array configurations. They can take the form of common circuit devices or application specific custom devices. These designs are the solution in combining both passive and active component networks directly on the IC surface, in a wafer level chip-scale package format, to meet the growing industry requirements.

The benefits of passive component integration are both technical and financial. Technically, they simplify the design process and enable much greater circuit densities. This allows equipment to be more compact, and with shorter in-circuit chip distances that reduce interconnection inductance, the circuit performance is improved. Component count is also reduced, leading to higher overall reliability.

Financial benefits include the significant reductions in cost that can be made by eliminating pick and place machine use. Tape and reel positions historically used for low value components are freed up for higher value parts, with faster assembly using fewer parts increasing manufacturing efficiency. Overhead costs associated with logistics and component inventories are also reduced. Processing and assembly cycle times are decreased. Combined with pre-testing and yield screening of the independently processed glass / component redistribution layer, final packaged financial benefits can be significantly increased